MLPF-WB55-01E3 ST RF Filters
The MLPF-WB55-01E3 from STMicroelectronics is a fully integrated 2.45GHz low‑pass filter with impedance matching, purpose‑built as a companion chip for STM32WB55Cx/Rx, STM32WB50Cx, STM32WB35Cx, and STM32WB30Cx wireless MCUs. For selection, the device integrates an impedance matching network and a harmonic filter into a single miniature 1.6×1.0mm 6‑bump CSP package, completely eliminating the need for discrete matching components. Key specifications include a 100MHz bandwidth (2.4–2.5GHz), 50Ω nominal antenna impedance, 1.1dB typical insertion loss, and a deep‑rejection harmonic filter that ensures regulatory compliance. ST's IPD technology on a non‑conductive glass substrate and an ECOPACK2‑compliant, RoHS‑certified design ensure high RF performance and reliability across −40°C to +105°C. In application, it is optimized for Bluetooth 5, Zigbee, OpenThread, and IEEE 802.15.14 wireless protocols. Typical end uses include IoT sensor nodes, smart‑home devices, lighting control, building automation, industrial wireless sensors, and personal electronics where maximizing RF performance while minimizing BOM count and PCB area is critical. In stock at HL Electronics – request a quote for fast delivery.
Pricing (USD)
| Quantity | Unit Price |
|---|---|
| 1+ | $ 0.28 |
| 100+ | $ 0.23 |
| 1250+ | $ 0.20 |
| 2500+ | $ 0.19 |
| 5000+ | $ 0.18 |
| 30000+ | $ 0.18 |
| 65000+ | $ 0.18 |
Technical Specifications
- Part No.MLPF-WB55-01E3
- Category RF/IF and RFID > RF Filters
- Manufacturer STMicroelectronics
- Packaging Tape & Reel (TR)
- Part Status Active
- Type Low Pass
- Center Frequency 2.45GHz
- Bandwidth 100MHz
- Insertion Loss 1.1dB
- Attenuation 40dB @ 2*fc / 45dB @ 3*fc
- Impedance 50 Ohm (Antenna Side)
- Technology IPD (Integrated Passive Device)
- Substrate Non-Conductive Glass
- Harmonics Filter Deep Rejection
- Matching Integrated to STM32WB55Cx/Rx, STM32WB50Cx, STM32WB35Cx, STM32WB30Cx
- RF Application Bluetooth 5, OpenThread, Zigbee, IEEE 802.15.4
- Number of Pins 6
- Package Type WLCSP / LGA Footprint
- Mounting Type Surface Mount
- Supplier Device Package 6-SMD, No Lead
- Size / Dimension 0.063" L x 0.039" W (1.60mm x 1.00mm)
- Height (Max) 0.017" (0.43mm)
- Thickness (Max) 450 μm
- Operating Temperature -40°C ~ 105°C
- Grade Industrial
- Moisture Sensitivity Level (MSL) 1 (Unlimited)
- RoHS Status ROHS3 Compliant
- ECOPACK ECOPACK2
- REACH Status REACH Unaffected
- ESD Rating (HBM) 2000V (JESD22-A114-C)
- ESD Rating (MM) 200V
- ECCN EAR99
- HTSUS 8504.50.8000
- Base Product Number MLPF
- Standard Package 5000
